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PCM(phase change material) refers to a thermal interface material that absorb or release an amount of heat energy when it undergoes a pahse transition. Widely used as TIMs in CPU, GPU, IC package and high power devices.
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AST-PCM88xx series has excellent abilities of wetting surfaces and filling gaps between surfaces. Low thermal impedance quickly conducts heat and greatly improve thermal dissipation.
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Low BLT(0.02mm)、high filling to minor openings or holes、high tightness、high thermal conductivity.
Specification
Features
Excellent thermal conduct performance
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High thermal conductivity (9.6 w/m•K)
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Low and stable thermal impedance(0.03~0.05 ℃·cm²/W)
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Low BLT (Bond Line Thickness: 0.02 mm)
Excellent processability
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Easy attach on the surface of heat dissipator or the surface of heat source.
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Less pump out issue.
AST-PCM8896’s excellent TI stability and reliability performances provide an optimized option in a thermal solution to support a steady and well performed output in high power systems.
Application
CPU, GPU, ASIC, IGBT, UV-LED, Hi-power Lighting,Hi-power IC...,etc.
By industry:
AI, PC/HPC, Server, Smart phone, Automobile, Telecommunication, Battery, Power supply